@article{b1d370c647614a46add1df0f8278f49a,
title = "Real-time Monitoring of the Semiconductor Wirebond Interconnection Process for Production Yield and Quality Improvement",
keywords = "Wirebond, Production Yield, Quality Improvement, Device Under Test",
author = "Haldos, \{Reymart Rio C\} and Abu, \{Patricia Angela R\} and Oppus, \{Carlos M\} and Reyes, \{Rosula SJ\}",
note = "Haldos, R., Abu, P., Oppus, C., \& Reyes, R. (2020). Real-time Monitoring of the Semiconductor Wirebond Interconnection Process for Production Yield and Quality Improvement. Proceedings of the International Conference on Industrial Engineering and Operations Management, March 10-12, 2020, 678-686. Dubai, UAE: IEOM Society International.",
year = "2020",
month = mar,
day = "1",
language = "American English",
journal = "Electronics, Computer, and Communications Engineering Faculty Publications",
}