@inproceedings{c22187b9592d4e17a059987c8a316101,
title = "Real-time monitoring of the semiconductor wirebond interconnection process for production yield and quality improvement",
keywords = "Device under test, Production yield, Quality improvement, Wirebond",
author = "Haldos, {Reymart Rio C.} and Abu, {Patricia Angela R.} and Oppus, {Carlos M.} and Reyes, {Rosula S.J.}",
note = "Publisher Copyright: {\textcopyright} IEOM Society International.; 10th Annual International IEOM Conference, IEOM 2020 ; Conference date: 10-03-2020 Through 12-03-2020",
year = "2020",
language = "English",
isbn = "9781532359491",
series = "Proceedings of the International Conference on Industrial Engineering and Operations Management",
publisher = "IEOM Society",
number = "March",
pages = "678--686",
booktitle = "Proceedings of the International Conference on Industrial Engineering and Operations Management",
edition = "March",
}